COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
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United States of America Patent
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Issued Date -
Jan 8, 2009
app pub date -
Dec 27, 2007
filing date -
Dec 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the first substrate and the first semiconductor chip.
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