Sealed Sensor Assembly and Method of Making the Same
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United States of America Patent
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N/A
Issued Date -
Jan 8, 2009
app pub date -
Aug 29, 2007
filing date -
Aug 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of sealing a sensor assembly from contaminants including inserting the assembly into an overmold, providing a first stage overmold to cover a first portion of said sensor assembly intended to be external to an associated bore, and providing a second stage overmold to cover a second portion of the assembly intended to be disposed in the associated bore.
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