MICRONEEDLE STRUCTURES AND CORRESPONDING PRODUCTION METHODS EMPLOYING A BACKSIDE WET ETCH
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United States of America Patent
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Issued Date -
Jan 8, 2009
app pub date -
Mar 18, 2008
filing date -
Mar 18, 2007
priority date (Note) -
Abandoned
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Abstract
A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate with a first part of a through-bore, formed by a dry etching process, passing through the microneedle and through a part of a thickness of the substrate. The backside of the wafer is also processed to form a second part of the through-bore by a wet etching process.
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