SEAL RING FOR GLASS WALL MICROELECTRONICS PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 15, 2009
app pub date -
Jul 10, 2007
filing date -
Jul 10, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A seal ring formed from a conductive material has at least one recessed area formed on an internal or external surface which is dimensioned to permit attachment of a wire bond so that the wire and any attachment material remain recessed from the upper and lower contact surfaces of the seal ring, allowing the seal ring to make flat and even contact with the adjacent package layer so that a hermetic seal is formed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully