Processing System Platen having a Variable Thermal Conductivity Profile
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United States of America Patent
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Issued Date -
Jan 15, 2009
app pub date -
Jun 20, 2008
filing date -
Jul 10, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A platen for a processing system includes a first and a second thermal region that are separated by at least one boundary. A first fluid conduit is positioned in the first thermal region. A second fluid conduit is positioned in the second thermal region. A fluid reservoir having a first output is coupled to the first fluid conduit and a second output that is coupled to the second fluid conduit. The fluid reservoir provides fluid to the first fluid conduit with first fluid conditions that provides a first thermal conductivity to the first thermal region and provides fluid to the second fluid conduit with second fluid conditions that provides a second thermal conductivity to the second thermal region so that a predetermined thermal conductivity profile is achieved in the platen.
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