Alignment correction system and method of use
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United States of America Patent
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Sep 22, 2009
Grant Date -
Jan 22, 2009
app pub date -
Jul 17, 2007
filing date -
Jul 17, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.
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