Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

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United States of America Patent

APP PUB NO 20090022949A1
SERIAL NO

12086152

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Opposed to a substrate (2) having a functional element (1) with a functional portion (1a) mounted thereon, there is disposed a resin sealing plate (3) provided with an opening (3a) corresponding to the functional portion (1a) of the functional element (1) with a given spacing therebetween. Impregnation and filling of a sealing resin (5) in the spacing between the substrate (2) and the resin sealing plate (3) are carried out by the use of the capillary phenomenon. Thus, resin sealing of the functional element (1) can be realized without damaging to the function of the functional portion (1a).

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Patent Owner(s)

Patent OwnerAddress
SONY CHEMICAL & INFORMATION DEVICE CORPORATIONTOKYO 141-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asada, Takahiro Ishikawa-ken , JP 28 90
Horita, Yoshihito Ishikawa-ken , JP 1 6
Kanisawa, Shiyuki Tochigi-ken , JP 34 438
Yoneda, Yoshihiro Ishikawa-ken , JP 165 1518

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