Process for molding a friction wafer
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United States of America Patent
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May 4, 2010
Grant Date -
Jan 29, 2009
app pub date -
Aug 24, 2006
filing date -
Aug 24, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
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