Method for forming ferroelectric thin films, the use of the method and a memory with a ferroelectric oligomer memory material
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United States of America Patent
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Issued Date -
Jan 29, 2009
app pub date -
May 2, 2006
filing date -
May 10, 2005
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Abandoned
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Abstract
In a method for forming ferroelectric thin films of vinylidene fluoride oligomer or vinylidene fluoride co-oligomer, oligomer material is evaporated in vacuum chamber and deposited as a thin film on a substrate which is cooled to a temperature in a range determined by process parameters and physical properties of the deposited VDF oligomer or co-oligomer thin film. In an application of the method of the invention for fabricating ferroelectric memory cells or ferroelectric memory devices, a ferroelectric memory material is provided in the form of a thin film of VDF oligomer or VDF co-oligomer located between electrode structures. A ferroelectric memory cell or ferroelectric memory device fabricated in this manner has the memory material in the form of a thin film of VDF oligomer or VDF co-oligomer provided on at least one of first and second electrode structures, such that the thin film is provided on at least one of the electrode structures or between first and second electrode structures.
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