PHOTOMASK DEFECT-SHAPE RECOGNITION APPARATUS, PHOTOMASK DEFECT-SHAPE RECOGNITION METHOD, AND PHOTOMASK DEFECT CORRECTION METHOD

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United States of America Patent

APP PUB NO 20090028420A1
SERIAL NO

12175061

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To recognize a defect portion and a mask pattern with a distinctly distinguished state through AFM observation of a photomask without being influenced by a double-tips image, provided is a method of recognizing, through AFM observation of a photomask including a substrate (2) and the mask pattern formed on the substrate (2a) with a predetermined pattern, a shape (5) of a projection type defect portion projected from the mask pattern, including the steps of storing a reference image an observation image in which an edge line of the defect portion is first confirmed at the time of AFM observation; and correcting, after the storing step, the edge line (L2) of the defect portion confirmed through the observation image obtained by the scanning performed hereinafter into a normal line (L1) with reference to the reference image, in which the shape of the defect portion is recognized based on the observed image after the correction.

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Patent Owner(s)

Patent OwnerAddress
SII NANOTECHNOLOGY INCCHIBA COUNTY CHIBA JAPAN CHIBA-SHI CHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakaue, Takuya Chiba-shi , JP 7 22
Takaoka, Osamu Chiba-shi , JP 36 142
Uemoto, Atsushi Chiba-shi , JP 46 301

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