PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Jan 29, 2009
app pub date -
Jan 19, 2007
filing date -
Jan 24, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a photosensitive resin composition and a resin film obtained from the photosensitive resin particularly useful for a buffer coating material for LSI chips. For this purpose, there are used a photosensitive resin composition, comprising: 100 parts by weight of a polycondensate obtained by condensation-polymerizing compounds represented by specific chemical formulas in a specific mixing ratio, 0.01 to 5 parts by weight of a photopolymerization initiator and 1 to 30 parts by weight of a specific organosilane, and a resin film obtained by coating the photosensitive resin composition on a silicon wafer surface, exposing the coated film, developing the exposed film, and curing the developed film.
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