LED Light Source with Increased Thermal Conductivity

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090032829A1
SERIAL NO

11830535

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A light source and method for making the same are disclosed. The light source includes a substrate, a plurality of dies and a transparent layer of encapsulant. The substrate includes an insulating layer having top and bottom surfaces, the top surface having a first metal patterned layer thereon, and the bottom surface having a second metal patterned layer thereon. The first metal patterned layer has a plurality of die mounting areas thereon, and the second metal patterned layer includes a first contact layer that underlies the die mounting area, the die mounting area and the first contact layer being connected by metal lined vias at each of the die mounting areas. The transparent encapsulant covers the plurality of dies and is bonded to the first metal patterned layer and the top surface of the insulating layer.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE LTDSINGAPORE SINGAPORE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chew, Tong Fatt Penang, MY 30 756
Lim, Seong Choon Penang, MY 13 257
Pang, Siew It Penang , MY 32 893

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