INTEGRATED CIRCUIT
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United States of America Patent
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N/A
Issued Date -
Feb 5, 2009
app pub date -
Aug 1, 2007
filing date -
Aug 1, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Integrated circuits and methods for making integrated circuits having a base layer, a side substrate, a circuit substrate and a connection. A bottom face of the base layer is disposed on the side substrate. The side substrate includes a first contact field, at least a second contact field, and a signal line. The first contact field is arranged on the bottom face in an area of an opening of the base layer, the second contact field is arranged on another face of the side substrate, and the signal line connects the first contact field to the second contact field. The circuit substrate is disposed on the base layer and alongside the side substrate. The connection connects the circuit substrate to the second contact field of the side substrate.
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