Assembly of Encapsulated Electronic Components to a Printed Circuit Board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090035454A1
SERIAL NO

12182043

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The components, central bonding material, and printed circuit board are then joined and interconnected.

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Patent Owner(s)

Patent OwnerAddress
OCCAM PORTFOLIO LLC20400 STEVENS CREEK BLVD 5TH FLOOR I P LEGAL CUPERTINO CA 95014

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fjelstad, Joseph C Maple Valley, US 86 2020

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