POLISHING HEAD AND CHEMICAL MECHANICAL POLISHING PROCESS USING THE SAME
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United States of America Patent
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Issued Date -
Feb 5, 2009
app pub date -
Aug 3, 2007
filing date -
Aug 3, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing head for a chemical mechanical polishing process is provided. The polishing head includes an inner circle part and an outer circle part. The outer circle part is a ring-like structure that is connected to the inner circle part. The inner circle part and the outer circle part are an integrated structure. There is a level difference between the respective surfaces of the outer circle part and the inner circle part. Further, the surface of the outer circle part is higher than that of the inner circle part.
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