COMPUTER COOLING SYSTEM AND METHOD
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United States of America Patent
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N/A
Issued Date -
Feb 12, 2009
app pub date -
Aug 7, 2008
filing date -
Aug 7, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for providing a computer component includes providing a motherboard apart from a cooling solution such that the end user can select the motherboard and cooling solution separately, based on preferences and needs for each and connect them together after they are selected. To support this method, a motherboard includes: a support board; a chipset mounted on the support board; and a heat sink base mounted over the chipset, the heat sink base including an open, planar upper surface devoid of any cooling system working components pre-installed thereon but including a fastener aperture about the edge of the open, planar upper surface and in addition to any support board mounting connections, the fastener aperture formed to accept releasable connectors for securing the selected cooling working component.
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