Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
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United States of America Patent
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Sep 14, 2010
Grant Date -
Feb 12, 2009
app pub date -
Jul 18, 2008
filing date -
Jul 20, 2007
priority date (Note) -
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Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
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