CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX

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United States of America Patent

APP PUB NO 20090042762A1
SERIAL NO

12280720

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Abstract

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  General Formula (7)where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.

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Patent Owner(s)

Patent OwnerAddress
ARAKAWA CHEMICAL INDUSTRIES LTDOSAKA JAPAN OSAKA-SHI OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zenfuku, Kazutaka Osaka, JP 3 32

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