Importance

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Abstract

An image sensor package is provided including a substrate; a sensor chip; a plurality of bond wires for connecting the sensor chip to the substrate at predetermined locations; a sensor housing on the substrate for substantially encompassing the sensor chip, the sensor housing having a through-hole cavity defining an optical glass (IR filter) seat, the sensor housing defining an upper surface and an edge surface thereof; an optical glass (IR filter) on the optical glass (IR filter) seat; an encapsulation material for substantially encapsulating the upper surface and edge surface of the sensor housing, a corresponding surface of the substrate adjacent the edge surface of the sensor housing, and the side edge of the optical glass (IR filter); wherein the sensor housing is provided with a gas-exit allowing possible high temperature gas to exit; the encapsulation material forms an upper surface which is substantially aligned with a top surface of the optical glass (IR filter); the encapsulation material forms an upper surface which is lower than a top surface of the optical glass (IR filter); the sensor housing defines a profile shape, the profile shape has at least a step-wise configuration for facilitating and accommodating flowing of the encapsulation material; the sensor housing has a bottom surface adhered to the substrate by an adhesive; and a slot is provided on the bottom surface of the sensor housing for accommodating the adhesive.

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First Claim