Electronic component mounting method providing a substrate standby area
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United States of America Patent
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Jul 29, 2014
Grant Date -
Feb 26, 2009
app pub date -
Aug 19, 2008
filing date -
Aug 23, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.
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