CORNER I/O PAD DENSITY
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United States of America Patent
Stats
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N/A
Issued Date -
Feb 26, 2009
app pub date -
Aug 24, 2007
filing date -
Aug 24, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit die has a plurality of I/O cells disposed about its periphery, each I/O cell having an I/O bonding pad. A first group of I/O cells is disposed at the periphery of the die at locations away from corners of the die, each of the first group of I/O cells having an I/O pad disposed thereon and spaced at a first distance from the periphery of the die. A second group of I/O cells is disposed at the periphery of the die at locations away from corners of the die, each of the second group of I/O cells having an I/O pad disposed thereon and spaced at a distance from the periphery of the die more than the first distance, the distance increasing as a function of the proximity of each I/O cell to a corner of the die.
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