Electronic Sensor
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United States of America Patent
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N/A
Issued Date -
Feb 26, 2009
app pub date -
Aug 19, 2008
filing date -
Aug 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high-temperature platform chip has at least three electrodes on an electrically insulating substrate constructed as a heating plate with a heat conductor on the back side.
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