Optimized CMP conditioner design for next generation oxide/metal CMP
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United States of America Patent
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Feb 25, 2014
Grant Date -
Feb 26, 2009
app pub date -
Aug 21, 2008
filing date -
Aug 23, 2007
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Abstract
A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.
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