METHOD OF RECYCLING ABRASIVE SLURRY
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United States of America Patent
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Issued Date -
Feb 26, 2009
app pub date -
Aug 15, 2008
filing date -
Aug 23, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound to the used slurry having been added with the dispersant so as to disperse a gelled portion and aggregated silica in the used slurry; and, by using a filter, removing a foreign substance contained in the used slurry having been irradiated with the ultrasound.
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