APPARATUS FOR MAINTAINING A CLEAN BONDING ENVIROMENT
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United States of America Patent
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Issued Date -
Mar 5, 2009
app pub date -
Aug 28, 2007
filing date -
Aug 28, 2007
priority date (Note) -
Abandoned
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Abstract
A bonding apparatus for bonding materials onto a substrate supported on a substrate support is provided with an air generator that is arranged and configured to direct an air flow onto the substrate during bonding. The air generator is located on one side of the substrate support, whereas a suction device is located on an opposite side of the substrate support which is operative to draw the air flow away from the bonding apparatus. The air generator further comprises an air knife that is operative to generate a unidirectional air flow over an entire length of the substrate during bonding.
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