Importance

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Abstract

A method for the singulation of hybrid circuits from a pre-scribed plate containing hybrid circuits or made of other brittle materials. The method includes the steps of providing a platen used to support the hybrid plate and which has a surface comprised of a series of sections each angled downward from its adjacent section, aligning the plate on the platen so that the scribe lines align with the surface discontinuities at the angles between the sections, securing the plate to the platen with vacuum pressure, creating a pressure differential between a space above the plate and a space below the plate, and applying the pressure differential to sequentially break the plate along the pre-scribed lines by forcing the plate against the angles.

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First Claim