Method and apparatus for deposition

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United States of America Patent

APP PUB NO 20090065351A1
SERIAL NO

11900326

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Abstract

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A deposition system supplies a continuous flow of process gases and sequentially selects among the flowing process gases for delivery to a reaction chamber. In the reaction chamber the delivered process gas acts as an ionizing species and thereby effects the deposition of a target substance upon a substrate. Gases not selected for delivery to the reaction chamber are swept away by a vacuum pump. By making a plurality of process gases continuously available, sequentially selecting among the available process gases, and pumping unused gases away before they enter the reaction chamber, such a system and method provides for continuous, sequential, uninterrupted deposition of a variety of substances, while maintaining desired flow rates and chamber pressures.

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Patent Owner(s)

Patent OwnerAddress
OVONYX INC2956 WATERVIEW DRIVE ROCHESTER HILLS MI 48309

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nuss, Robert Westland, US 2 44

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