THIN CIRCUIT MODULE AND METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 19, 2009
app pub date -
Sep 18, 2007
filing date -
Sep 18, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit module includes a printed circuit board (PCB) having a first side, a second side, and a bottom perimeter edge. The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector.
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