Light Emitting Diode Package Assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 19, 2009
app pub date -
Sep 13, 2007
filing date -
Sep 13, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A light emitting diode package assembly is provided including a lower housing element and an upper housing element creating an internal pcb storage chamber. A light emitting diode driver pcb is mounted within. A light emitting diode pcb is mounted within and includes a light emitting diode element and a touch switch antenna. A personality pcb mounted is within between the light emitting diode driver pcb and the light emitting diode pcb. The personality pcb comprises touch switch circuitry and theatre dimming circuitry. At least one pcb interconnect places the light emitting diode driver pcb, the light emitting diode pcb and the personality pcb in communication with each other.
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