MICROFLUIDIC MODULE INCLUDING AN ADHESIVELESS SELF-BONDING REBONDABLE POLYIMIDE

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United States of America Patent

APP PUB NO 20090074615A1
SERIAL NO

11856227

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Abstract

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A microfluidic module that comprises an adhesiveless self-bonding rebondable polyimide film.

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Patent Owner(s)

Patent OwnerAddress
YSI INCORPORATED1700/1725 BRANNUM LANE YELLOW SPRINGS OH 95387

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moles, Donald R Cedarville, US 14 1428

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