METHODS FOR PATTERNING ELECTRONIC ELEMENTS AND FABRICATING MOLDS
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United States of America Patent
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Issued Date -
Mar 19, 2009
app pub date -
Sep 17, 2008
filing date -
Sep 17, 2007
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Abandoned
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Abstract
A method for patterning a surface includes providing a first layer of mechanically deformable material having a first surface. A second layer of mechanically deformable material is placed on the first surface. At least a portion of the second layer is controllably displaced to form at least one patterned void through the second layer.
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