Thermal intermediate apparatus, systems, and methods
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United States of America Patent
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Jul 26, 2011
Grant Date -
Mar 19, 2009
app pub date -
Nov 24, 2008
filing date -
Dec 30, 2003
priority date (Note) -
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Abstract
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
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