MULTI-DIRECTIONAL TRENCHING OF A PLURALITY OF DIES IN MANUFACTURING SUPERJUNCTION DEVICES
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United States of America Patent
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Issued Date -
Apr 2, 2009
app pub date -
Feb 15, 2008
filing date -
Sep 28, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing a superjunction device includes providing a semiconductor wafer having a plurality of dies. A first plurality of trenches having a first orientation are formed in a first die. A second plurality of trenches having a second orientation are formed in a second die. The second orientation is different from the first orientation.
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