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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HORIBA LTD	KYOTO 601-8510
THE DOSHISHA	KYOTO 602-8580
HORIBA STEC CO LTD	11-5 HOKOTATE-CHO KAMITOBA MINAMI-KU KYOTO-SHI KYOTO 601-8116

International Classification(s)

• B05C:APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
• B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ishida, Kozo	Kyoto, JP	41	403
Komeda, Akiko	Kyoto , JP	3	6
Matsuda, Koichiro	Kyoto, JP	8	21
Oshima, Motohiro	Kyoto, JP	3	7
Senda, Jiro	Kyoto , JP	7	33
Shimizu, Tetsuo	Kyoto , JP	204	2451
Tominaga, Koji	Kyoto , JP	30	192

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2009/0092,741

METHOD FOR FORMING FILM AND FILM FORMING SYSTEM

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