Connecting structure for connecting at least one semiconductor component to a power semiconductor module
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United States of America Patent
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Issued Date -
Apr 16, 2009
app pub date -
Sep 19, 2008
filing date -
Sep 19, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A connecting structure comprising a connecting device for electrically conductive connection to at least one semiconductor component and a filler. The connecting device is a film composite comprising at least two electrical films with an insulating film therebetween. The electrically conductive films are inherently structured and thus form conductor tracks. At least one semiconductor component is assigned to at least one cutout in the respective conductive film, wherein the filler is situated between the connecting device and the assigned semiconductor component.
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