METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD
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United States of America Patent
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Issued Date -
Apr 23, 2009
app pub date -
Oct 7, 2008
filing date -
Oct 17, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A molded product (consisting of resin compact and substrate) is formed by sealing and molding an electronic component mounted on a substrate in a resin compact by injecting/charging a heated/molten resin material into a cavity. Then, when a pressing member presses an ejector plate urged in a return direction (downward) in an ejective direction (upward) through a presser, a return pin guides mold releasing pins fixedly provided on the ejector plate, thereby ejecting and releasing the molded product from a mold with the mold releasing pins. Upon defective sliding of the mold releasing pins, the mold releasing pins can be returned to return positions by pressing the return pin with an upper mold section.
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