Power Integrated Circuit with Bond-Wire Current Sense
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United States of America Patent
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N/A
Issued Date -
Apr 23, 2009
app pub date -
Oct 18, 2007
filing date -
Oct 18, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit product includes: 1) a package, 2) a semiconductor die mounted within the package, 3) a first terminal and a second terminal for connecting the integrated circuit product to an external circuit, 4) one or more bond wires for transferring a current received at the first terminal to the second terminal; and 5) a circuit included in the semiconductor die that measures a voltage difference attributable to the resistance of the bond wires to measure the magnitude of the current passing through the first terminal.
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