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United States of America Patent

PATENT NO 8525314
APP PUB NO 20090104736A1
SERIAL NO

11666975

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Abstract

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A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.

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Patent Owner(s)

  • TESSERA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beroz, Masud San Jose, US 103 3166
Haba, Belgacem Saratoga, US 718 20714
Mitchell, Craig S San Jose, US 38 2082

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