CURABLE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Apr 23, 2009
app pub date -
Apr 17, 2007
filing date -
Apr 25, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is directed to a novel functional polyorganosiloxane having on average two or more vinyl groups in one molecule thereof.The polyorganosiloxane is represented by the following formula (I): (I)represents a methyl group or a phenyl group; and Ph denotes a phenyl group) and is produced through polycondensation of an alkoxysilane mixture in the presence of an active solvent.The present invention also relates to a curable resin composition containing the polyorganosiloxane, which composition is suitably employed for encapsulating optical devices such as LEDs, photo-sensors, and lasers as well as optical materials.The invention further relates to a composition for encapsulating an LED suitable for encapsulating LEDs emitting blue to UV light and white light-emitting devices.
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