Method and apparatus to prewet wafer surface for metallization from electrolyte solutions
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United States of America Patent
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app pub date -
Dec 27, 2007
filing date -
Oct 30, 2007
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Abstract
The present invention improves the wetting between electrolyte and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the plating process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface.
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