Non-leaded semiconductor package structure
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 29, 2007
filing date -
Oct 29, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A non-leaded semiconductor package structure is proposed, in which the structure of a lead frame is improved to let the lower surface of a die paddle of the lead frame be used to carry a die and the upper surface thereof be exposed out of the package structure. Moreover, a plurality of leads of the lead frame is located at the periphery of the lower surface of the die paddle. Each lead has an inner lead and an outer lead, and the outer lead is exposed out of the package structure. The package structure thus formed has a good heat-radiating effect and a reduced chance of leakage current.
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