WAFER SCALE INTEGRATED THERMAL HEAT SPREADER
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 29, 2007
filing date -
Oct 29, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Various embodiments are directed to providing an electronic device with an integrated thermal heat spreader. In one embodiment, an electronic device may comprise an integrated circuit fabricated on a substrate and a heat spreader integrated with the electronic device after fabrication of the integrated circuit. The heat spreader may comprise one or more layers of composite plating material including solid particles incorporated into a metal plating material. The composite plating material may be patterned to the substrate to define the heat spreader. Other embodiments are described and claimed.
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