ENCAPSULATED SPATIAL LIGHT MODULATOR HAVING LARGE ACTIVE AREA
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 30, 2007
filing date -
Oct 30, 2007
priority date (Note) -
Abandoned
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Abstract
A die for spatial light modulation includes a substrate having a top surface having a length less than 15 mm and a width less than 11 mm, a spacer wall on the top surface of the substrate, a transparent encapsulation cover on the spacer wall, wherein the spacer wall and the encapsulation cover define a cavity over the substrate, a spatial light modulator on the substrate and within the cavity, and an opaque aperture layer on a surface of the encapsulation cover. The aperture layer includes an opening exposing the transparent window to allow the spatial light modulator to receive a light beam from outside of the cavity or send a light beam outside of the cavity. The spacer wall has a thickness equal to or less than 0.5 millimeters.
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