Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
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United States of America Patent
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Dec 27, 2011
Grant Date -
Apr 30, 2009
app pub date -
Oct 31, 2008
filing date -
Oct 31, 2007
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Abstract
A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.
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