Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 25, 2007
filing date -
Oct 25, 2007
priority date (Note) -
Abandoned
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Abstract
Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking agents, adhesion promoters, and other inorganic fillers. The composition of the present disclosure can have a glass transition temperature greater than 250° C. and a water absorption factor of less than 2%, and a positive solubility measurement.
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