Method of manufacture of wire imbedded inlay
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United States of America Patent
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Issued Date -
May 14, 2009
app pub date -
Nov 14, 2007
filing date -
Nov 14, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacture of wire-embedded inlays, the method including providing a substrate, applying a coating to the substrate, which coating melts at an elevated temperature characteristic of wire-embedding, thereby producing an inlay substrate and when the coating is solid, employing wire embedding techniques for embedding a wire into the inlay substrate.
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