Structure and method for placement, sizing and shaping of dummy structures
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United States of America Patent
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Jan 11, 2011
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N/A
app pub date -
Jan 13, 2009
filing date -
Sep 24, 2003
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Abstract
A material layer on a substrate being processed, e.g. to form chips, includes one or more functional structures. In order to control pattern density during fabrication of the chip, dummy fill structures of different sizes and shapes are added to the chip at different distances from the functional structures of the material layer. In particular, the placement, size and shape of the dummy structures are determined as a function of a distance to, and density of, the functional structures of the material layer.
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