POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
May 21, 2009
app pub date -
Sep 1, 2006
filing date -
Sep 2, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing composition contains a triazole having a 6-membered ring skeleton, a water soluble polymer, an oxidant, and abrasive grains. The triazole has a hydrophobic functional group in the 6-membered ring skeleton. The content of the triazole in the polishing composition is 3 g/L or less. The pH of the polishing composition is 7 or more. The polishing composition is suitably used in polishing for forming wiring of a semiconductor device.
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