Method and system for providing a reliable semiconductor assembly
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United States of America Patent
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Jul 16, 2013
Grant Date -
May 21, 2009
app pub date -
Nov 20, 2007
filing date -
Nov 20, 2007
priority date (Note) -
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Abstract
A semiconductor assembly is provided that includes a substrate. A first set of non-conductive hedges is disposed on and protrudes from a first surface of the substrate. A chip is coupled to and spaced apart from the substrate. The chip has a second surface facing the first surface of the substrate. A second set of non-conductive hedges is disposed on and protrudes from the second surface of the chip. The first set of hedges is configured and positioned to engage the second set of hedges to restrict movement of the substrate with respect to the chip. The second set of hedges is configured and positioned to engage the first set of hedges to restrict movement of the chip with respect to the substrate.
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