MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION
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United States of America Patent
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Issued Date -
May 21, 2009
app pub date -
Nov 15, 2007
filing date -
Nov 15, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a second integrated circuit device over the first integrated circuit device includes: attaching the second integrated circuit device to a first substrate side of a substrate, and connecting a first electrical interconnect between the second integrated circuit device and a second substrate side of the substrate through an opening in the substrate. The mountable integrated circuit package system further including: forming a package encapsulation over the first integrated circuit device and the carrier with the substrate partially exposed.
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